EVGA X299 FTW K, LGA 2066, Intel X299, SATA 6Gb/s, USB 3.1, USB 3.0, EATX, Intel Motherboard 142-SX-E297-KR

  • Supports Intel Core X-Series cascade lake-X, Skylake-X and Kaby lake-X processors for 2066 socket.
  • operating System Support: Windows 10 64-bit.
  • 32GB DIMM support - 4 DIMM Quad-Channel DDR4 up to 256GB 4000MHz+ cascade lake-X/Skylake-X, and 128GB 4133MHz+ Kaby lake-X.
  • 4 USB 2.0 Ports (2 internal headers), 8 USB 3.1 Gen1 Ports (6 rear panel, 2 from 1 internal header), 2 USB 3.1 Gen2 Ports (1x Type-A, 1x Type-C).
  • 8 SATA 6 Gb/s ports, 2 M.2 Key-M 110mm, 80mm (up to 32Gbps), 1 M.2 Key-E 32mm, 2 U.2 port.
  • New EVGA GUI BIOS features in-bios stress test and OC robot to auto-overclock your CPU and set per Core Clock speeds and voltages.
  • Get grip game + EVGA vehicle skin w/ Purchase, redeemed at EVGA website, while supplies last.
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EVGA X299 MICRO ATX 2, LGA 2066, Intel X299, SATA 6Gb/s, USB 3.1 Gen2, USB 3.1 Gen1, mATX, Intel Motherboard 121-SX-E296-KR

  • Supports Intel Core X-Series cascade lake-X and Skylake-X processors for 2066 socket.
  • Matx form Factor + metal-reinforced PCIe and DIMM slots.
  • 32GB DIMM support - Quad-Channel DDR4 up to 128GB 4000MHz+ cascade lake-X/Skylake-X.
  • New EVGA GUI BIOS features in-bios stress test and OC robot to auto-overclock your CPU and set per Core Clock speeds and voltages.
  • Highly-efficient 14 Phase digital VRM with actively-cooled VRM heatsink.4 USB 2. 0 Ports (2 internal headers), 8 USB 3. 1 Gen1 Ports (6 rear panel, 2 from 1 internal header), 2 USB 3. 1 Gen2 Ports (Type-A).6 SATA 6 Gb/s ports, 1 M. 2 Key-M 80mm (up to 32Gbps), 1 M. 2 Key-E 32mm. 100% Solid State Capacitors, 150% Increased Socket Gold Content.New integrated EVGA Wi-Fi/BT module + Flash BIOS without a CPU.Get grip game + EVGA vehicle skin w/ Purchase, redeemed at EVGA website, while supplies last.
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ASUS ROG GL551VW-DS71 Gaming Notebook

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der8auer Delid-Die-Mate X Integrated Heatspreader Removal Tool

  • Practical tool for removing the heat spreader of a CPU.
  • Compatible with all Intel Skylake-X and Kaby Lake-X processors using socket 2066.
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CORSAIR RMX Series RM850x 850 Watt 80+ Gold Certified Fully Modular Power Supply

  • 80 PLUS Gold certified: High efficiency operation for less excess heat and lower operating costs.
  • 100% All Japanese 105 capacitors: Premium internal components ensure solid power delivery and long term reliability.
  • Zero RPM Fan Mode: Virtually silent operation at low and medium loads.
  • Fully Modular: Make your builds and upgrades easy, with clean, great-looking results.
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Dynatron Y506 2U Skylake LGA 1151 with Aluminum CPU Cooler

  • CPU Socket: Skylake LGA 1151, Haswell LGA1150 and LGA1155/1156 up to TDP 95 Watts.
  • CPU Support: LGA 1155: Intel 2nd Generation Core i7-2600, i5-2500 series & Sandy Bridge Xeon Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280.
  • CPU Support: LGA 1156: Intel Core i3 i3-530 & i3-540, Core i5 i5-650, i5-650, i5-660, i5-661 i5-670 & I5-750.
  • Material: Copper Base with Aluminum Stacked Fin with Heat Pipes.
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Supermicro X11DPH-T Dual LGA 3647 Sockets Motherboard

  • Intel Xeon Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s, CPU1: Skylake-F CPU supported.
  • Up to 2TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots.
  • 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 M.2 Interface: PCIe 3.0 x4 and PCIe 3.0 x4 M.2 Form Factor: 22110 M.2 Key: M-Key (RAID 0,1 support).
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2017 Microsoft Surface Pro 4 12.3 Laptop/Tablet 2.2 GHz Intel Core M3 4GB RAM 128 GB SSD Windows 10 Pro Silver Renewed

  • 12.3in PixelSense 10-Point Touch Display.
  • Intel Core i5 6th Gen (Skylake), 4GB of Ram, 128GB SSD, Intel HD Graphics 520, 802.11ac Wi-Fi, Bluetooth 4.0.
  • Includes Microsoft Surface Pro 4, and Microsoft Type Cover.
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CORSAIR RMx Series, RM1000x, 1000 Watt, 80+ Gold , Fully Modular Power Supply (Renewed)

  • 80 PLUS Gold certified: High efficiency operation for less excess heat and lower operating costs.
  • 100% All Japanese 105 capacitors: Premium internal components ensure solid power delivery and long term reliability.
  • Zero RPM Fan Mode: Virtually silent operation at low and medium loads. 6th generation Intel Core processor Ready (Intel Skylake and Z170 motherboards)ATX12V v2.4 and EPS 2.92 standards and is backward compatible with ATX12V 2.2, 2.31 and ATX12V 2.01 systems.
  • Fully Modular: Make your builds and upgrades easy, with clean, great-looking results.
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Shuttle XPC Slim DH170 Mini Barebone PC Intel H170 LGA 1151 Kabylake/Skylake Heatpipe Cooling Module No CPU No Ram No HDD/SSD No OS,Black

  • Support Skylake CPUs: i3/i5/i7/Celeron/Pentium 65W Socket LGA1151 CPUs.
  • Supports maximum total size of 32 GB (max. 16 GB per module), 1333/1600 MHz RAM (2 x SODIMM).
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Asus ZENBOOK Pro UX501VW-XS74T Intel i7 16GB 512GB SSD Gaming GPU GTX 960M Touchscreen Windows 10 Pro Laptop

  • Display: 15.6" IPS UHD (3840 x 2160) Touchscreen Glossy Display Graphics Card: NVIDIA GeForce GTX 960M 4GB GDDR5.
  • Processor: 6th Gen Intel Skylake Core i7-6700HQ Quad Core (2.6GHz-3.5GHz, 6MB Intel Smart Cache, 45W).
  • GeForce GTX 960M with 4G GDDR5, 16 GB Memory 512 GB SSD.
  • 4K/UHD UHD Touchscreen, Windows 10 Pro 64-Bit.
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Microsoft Surface Book 2 15 Inch 1TB i7 16GB RAM Bundle (1.9GHz i7 Up to 4.2GHz, 3240 x 2160 Resolution, NVIDIA GeForce GTX 1060)

  • 2.6 GHz Intel Core i7-6600U (Skylake) 16GB of RAM + 1TB SSD.
  • 13.5" 3000 x 2000 Detachable Touchscreen NVIDIA GeForce GTX 965M Graphics (2GB).
  • USB 3.0, Mini DisplayPort, SD Card Slot 802.11ac Wi-Fi, Bluetooth 4.0.
  • Surface Pen Included 5MP Front and 8MP Rear Webcams.
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Shuttle XPC Slim DH110 Mini Barebone PC Intel H110 LGA 1151 Kabylake/Skylake Heatpipe Cooling Module No CPU No Ram No HDD/SSD No OS

  • No CPU, No Memory, No HDD, No ODD, No Operating System.
  • LGA1151, Supports Intel Skylake Core i3/ i5/ i7, Pentium, Celeron Processors, Supports up to 65W TDP.
  • Memory: 2x 204pin DDR3L-1600 SODIMM Slots, Dual Channel, Max Capacity of 32GB.
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